NTD6415AN, NVD6415AN
1600
1200
800
C iss
T J = 25 ° C
V GS = 0 V
10
8
6
4
Q gs
V DS
Q ds
Q T
V GS
100
80
60
40
400
2
20
0
0
C rss
20
C oss
40
60
80
100
0
0
5
10
15
20
I D = 23 A
T J = 25 ° C
25
0
30
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
Q g , TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source Voltage and
Drain ? to ? Source Voltage versus Total Charge
1000
V DS = 80 V
I D = 23 A
V GS = 10 V
25
20
T J = 25 ° C
V GS = 0 V
100
10
t f
t r
t d(off)
t d(on)
15
10
5
0.4
1
1
10
100
0
0.5 0.6 0.7 0.8
0.9
R G , GATE RESISTANCE ( W )
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
V SD , SOURCE ? TO ? DRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage versus
Current
1000
100
10
V GS = 10 V
SINGLE PULSE
T C = 25 ° C
10 m s
100 m s
1 ms
80
70
60
50
40
30
I D = 23 A
1
R DS(on) LIMIT
THERMAL LIMIT
10 ms
dc
20
10
0.1
1
PACKAGE LIMIT
10
100
1000
0
25
50
75
100
125
150
175
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
T J , STARTING JUNCTION TEMPERATURE
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
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